China Advances Lithography & Optics for Chips, Samsung Unveils New Memory Tech

China is intensifying efforts to develop its own lithography machines, essential for producing cutting-edge chips. By 2030, the country plans to release deep ultraviolet (DUV) immersion lithography systems capable of manufacturing 7-nm chips. However, creating extreme ultraviolet (EUV) machines remains a far greater challenge, requiring complex supply chains and thousands of specialists. Currently, China relies on ASML equipment, but export restrictions are pushing the search for alternatives.

Meanwhile, co-packaged optics (CPO) technology is gaining traction, enabling the integration of optical modules directly alongside processors or ASICs. This approach shortens electrical pathways, enhances data transfer speeds, and reduces power consumption—critical factors for modern data centers. Companies like TSMC, Intel, and Samsung have already outlined CPO adoption roadmaps, with TSMC targeting 400 Gbps speeds by 2030.

Samsung has unveiled three revolutionary memory technologies poised to reshape the market. zHBM promises an eightfold performance leap over HBM5, particularly valuable for AI accelerators. zNAND-O allows up to eight NAND layers on logic chips, while BV-NAND, as the 10th generation of V-NAND, is closest to commercial deployment. These innovations aim to boost efficiency and cut costs in high-performance computing and data storage segments.