TSMC to Begin Mass Production of 1.6nm Chips by Late 2026
Photo: Android Authority
Quick answer
TSMC has finalized its 1.6nm process, delivering an 8–10% performance uplift and 15–20% power efficiency gain over 2nm chips.
Taiwanese semiconductor leader TSMC has finalized development and verification of its 1.6nm process technology, designated A16. The innovation promises significant improvements in performance and energy efficiency over existing solutions.
The breakthrough is powered by Super Power Rail (SPR) architecture, which separates signal and power circuits. Previously, both types of wiring were confined to the wafer’s frontside, but the new approach routes power through the backside. This eliminates data bottlenecks, boosting computing power by 8–10% and cutting power consumption by 15–20% compared to 2nm processes. Transistor density has also increased by 8–10%.
According to reports, mass production of chips using the new process will begin in Q4 2026. TSMC views the 1.6nm technology as an interim step before transitioning to a 1.4nm process, which the company plans to launch by 2028. However, TSMC still has a long road ahead to match IBM’s 0.7nm architecture.
Common questions
- What improvements does TSMC’s new 1.6nm process offer?
- The 1.6nm process delivers an 8–10% increase in computing power and a 15–20% reduction in power consumption compared to 2nm chips. Transistor density also improves by 8–10%.
- When will TSMC start mass-producing 1.6nm chips?
- Mass production of 1.6nm chips is scheduled for the fourth quarter of 2026.
- What technology enables TSMC’s performance gains?
- TSMC uses Super Power Rail (SPR) architecture, which separates signal and power circuits by routing power through the backside of the wafer, eliminating data bottlenecks.
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